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Methodology kit addresses wireless design challenges

Posted: 15 Dec 2005 ?? ?Print Version ?Bookmark and Share

Keywords:Cadence Design Systems? RF Design Methodology Kit? wireless?

Cadence Design Systems Inc. announced its RF Design Methodology Kit, which is designed to address key challenges in wireless design. According to the company, this kit helps wireless chip designers achieve shorter, more predictable design cycles by better ensuring that silicon performance matches design intent.

The methodology kit leverages the latest technologies from Cadence for intelligently managing parasitic extraction and linking system-level design with IC implementation, and accurately, yet rapidly, verifying complete wireless designs that span digital, analog and RF. The kit includes an 802.11 b/g WLAN transceiver reference design, a full suite of RF verification IP, test plans, and applicability training on the RF design and analysis methodologies. The kit focuses on front-to-back RF IC design and addresses behavioral modeling, circuit simulation, layout, parasitic extraction and resimulation, and inductor synthesis. It also focuses on IC verification within a system context, leveraging system-level models and testbenches for use by designers in the IC environment.

Additionally, the RF Design Methodology Kit leverages accurate 3D extraction technology and advanced physical modeling capabilities from Assura RF, links to system-level environments, and key new functionality in the Virtuoso custom design platform with Flexible Balance option for calibrated results of transient and frequency analysis. The Virtuoso AMS Designer link to MATLAB and Simulink from The MathWorks is an example of a link to a key system-level design tool. The link to MATLAB and Simulink provides an executable specification that is continually elaborated throughout the development process. Thus, a common environment can be leveraged as IC designers verify against a system-level specification across multiple domains, including system, digital, mixed-signal and analog RF, said Cadence.

"Our customers continue to meet the market demands for ICs with wireless functionality, integrating voice and data capability with less power at a lower cost and within a shorter timeframe," said Ajay Malhotra, SVP of Marketing at Cadence. "We have seen tremendous customer interest in Cadence's kits approach and customers can expect more Cadence kits in the near future in areas of networking and consumer electronics."

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