Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > EDA/IP

Process R&D becomes 'a team sport'

Posted: 16 Dec 2005 ?? ?Print Version ?Bookmark and Share

Keywords:david lammers? dual-stress liner? strained silicon technology? pfet? nfet?

Even the mightiest manufacturer can't go for it alone anymore. ibm's recently developed dual-stress liner approach to strained-silicon technology came about through collaboration with its process development partners, said Paul Farrar Jr., process development manager at IBM Corp.'s semiconductor R&D center.

When IBM was mulling over strained silicon, Farrar said, "we got the PFET approach, but we were thinking about how to do the NFET and one of our partners had an answer. We might have gotten it eventually without the partner, but in my gut, I believe we wouldn't have done so without the partner's ideas." IBM works on process development with AMD, Chartered, Infineon, Samsung, Sony and Toshiba.

In a remarkable admission, Farrar acknowledged that previous partnerships foundered because of arrogance on the part of IBM. "Ten years ago, if we had gotten paid by the amount of ego we had at IBM, we all would have been millionaires," Farrar said in a keynote speech at an International Sematech conference in October.

Now, process technology development is "a team sport," Farrar said. "Now, we have a little humility and we at IBM believe that we have to really listen because, sometimes, the best idea is the one you get from someone else."

-David Lammers
EE Times

Article Comments - Process R&D becomes 'a team sport'
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top