IGP chipset delivers 2D/3D graphics

VIA Technologies Inc. announced the VIA CN700 IGP chipset. Optimized for use in low-power digital media applications, the chipset is well suited for use in VIA C7 processor-powered devices, such as mini PCs, fanless embedded commercial systems and home entertainment centers.

The integrated S3 Graphics UniChrome Pro IGP core is designed to provide high-level 2D/3D graphics performance with flexible display outputs for CRT and LCD, as well as standard definition and HDTV up to 1,080p resolution with a compatible DVI or TV encoder.

Supporting the VIA V4 bus up to 533MHz, the VIA CN700 IGP chipset supports both DDR2 and DDR memory modules with built-in system and graphics power management. When combined with the VIA VT8237A South Bridge, the VIA CN700 offers a comprehensive range of integrated storage, multimedia and connectivity options, including native Serial ATA and multiple configuration V-RAID, support for VIA Vinyl High Definition Audio, and high-throughput Gigabit Ethernet with the VIA Velocity controller.

VIA CN700 is expected to be available in volume quantities in Q1 2006.

- Janine Love
eeProductCenter