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Metrology tool handles high volume production of 300mm wafers

Posted: 12 Jan 2006 ?? ?Print Version ?Bookmark and Share

Keywords:nanotechnology? metrology tool? Metryx? Mentor DF3?

A new, non-destructive, nanotechnology weight metrology tool has been introduced by Metryx to handle high volume production of 300mm semiconductor wafers. According to the press release, the Mentor DF3 has been designed to easily adapt to handling a mixed wafer fab environment where 200mm and 300mm wafers are continually interchanged.

The tool is capable of measuring down to resolutions as low as 10?g (approximately one Angstrom of material thickness). Metryx added that the system offers atomic layer measurement accuracy using innovative nanotechnology weight metrology methods.

The new metrology tool is equipped with a standard Equipment Front End Module housing an atmospheric robot within a mini-environment. The wafer handling capabilities of the tool rely on two 300mm Front Opening Unified Pods (FOUPs) located side by side at the front of the system.

For use as a bridge tool, one of the tool's load-ports can be configured for 200mm (either open cassette or SMIF) operation while the other remains at 300mm. If more measurement capacity is required then an additional measurement station can be mounted on the system. The

tool is able to pre-identify the FOUP adaptors to achieve seamless handling.

Capable of throughputs in excess of 60 wafers per hour, the Mentor DF3 tool has a 2m2 footprint, and provides nanotechnology weight measurement of product, test and blanket wafers independent of substrate size or material.

Designed to monitor changes in process performance and quickly determine whether device manufacture process steps are operating correctly, the tool enables process changes to be reliably and accurately determined after deposition, wet or dry etch or CMP processing.

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