Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > EDA/IP

IBM, Sony, Toshiba tip 32nm alliance

Posted: 13 Jan 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Mark LaPedus?

IBM Corp., Sony Corp. and Toshiba Corp. disclosed yesterday (Jan. 12) that they have begun a new, five-year phase of their joint technology development alliance in ICs.

As part of this broad semiconductor R&D alliance, the three companies said they will work together on fundamental research related to advanced process technologies at the 32nm node and beyond.

Research and development will take place at IBM's Thomas J. Watson Research Center in Yorktown Heights, N.Y., the Center for Semiconductor Research at Albany NanoTech and at IBM's 300mm fab in East Fishkill, N.Y.

Over the last five years, the companies have collaborated on the "Cell" microprocessor design and its underlying silicon-on-insulator (SOI) process technologies at 90nm and 65nm.

Japan's Toshiba is said to be involved in other chip ventures; the company could be hedging its bets.

For example, seeking to regain lost ground in ICs, Hitachi, Renesas and Toshiba are expected to be among the first companies to form the long-awaited foundry fab venture in Japan, according to a report.

To complicate matters, NEC Electronics and Toshiba recently announced that the two companies would share the development of 45-nm CMOS logic manufacturing processes. In addition, starting with this joint development, the two companies have begun discussions on the possibility of a comprehensive alliance that would range from design and product development through to manufacturing.

- Mark LaPedus
EE Times

Article Comments - IBM, Sony, Toshiba tip 32nm alliance
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top