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TTPCom 3G modem reduces silicon area

Posted: 20 Jan 2006 ?? ?Print Version ?Bookmark and Share

Keywords:TTPCom? ARM? CBEmacro 3G modem?

TTPCom Ltd and ARM announced that comparative analysis revealed that wireless applications processors that integrate TTPCom's CBEmacro 3G modem occupy less silicon area than current solutions and benefit from the significantly greater efficiency and performance of the ARM1156T2-S processor subsystem to produce industry-leading power, performance and area (PPA).

Additionally, said the press release, the CBEmacro modem architecture will reduce silicon cost and improve battery life of dual mode WCDMA/EDGE and tri-mode HSDPA/EDGE baseband modems.

The CBEmacro modem design combines TTPCom's architecture with the ARM1156T2-S processor and AMBA Fabric technology to enable licensees to deliver compact and performance optimized dual-mode EDGE/WCDMA or tri-mode EDGE/HSDPA baseband silicon.

"BoM costs are crucial in today's competitive handset market where as little as 50 cents can make or break a deal. Consequently every millimeter of die area saved improves the economics of the deal," said Julian Hildersley, managing director of TTPCom's silicon business unit.




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