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Flip-Stack packaging supports wirebond-to-flip-chip transition

Posted: 25 Jan 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Flip-Stack? package? Amkor Technology? flip chip?

Amkor Technology Inc. announced the Flip-Stack package solution that is specifically designed to support emerging transition from wirebond to flip chip interconnect for high-performance DSPs, ASICs and RF chips in a range of consumer applications, including mobile phones, digital cameras and digital entertainment. Although 3D stacked die packages based on wirebond interconnect have been in high volume production for several years, advancements in wafer fabrication technology are driving the transition to flip-chip for performance reasons, said Amkor. The Flip-Stack CSP package targets devices utilizing advanced IC fab processes and combines the company's flip-chip process with conventional wirebond technology.

According to the press release, Flip-Stack CSP enables higher levels of silicon integration and device performance by stacking flash or mobile DRAM memory over high performance logic chips, such as DSP and ASIC. In the Flip-Stack CSP configuration, the bottom logic device is attached to the package substrate using Pb-free flip-chip solder bumps; the top ICs are then attached to the flip-chip die and wirebonded to the package substrate. Flip-Stack CSP is Pb-free and RoHS compliant, and is offered in a standard FBGA package outline.

Amkor added that the Flip-Stack CSP package offers a flip chip interconnect that addresses the need for improved electrical performance in consumer products containing high performance components, such as baseband processors and RF chips. The flip chip architecture means that Flip-Stack CSP may in some cases be designed into a smaller footprint than traditional wirebond-stacked CSP. The Flip-Stack package platform will also support the integration of passive devices within the package to enable total system-in-package functionality.

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