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Semi packaging materials to hit $20B in 2010

Posted: 25 Jan 2006 ?? ?Print Version ?Bookmark and Share

Keywords:semiconductor? packaging material? thermal interface material? SEMI? TechSearch International?

The market for semiconductor packaging materials, including thermal interface materials, is expected to grow from $12 billion in 2005 to $19.5 billion by 2010, according to a new study by SEMI and TechSearch International.

According to the two companies, laminate substrates are the largest segment of the market, worth $4.2 billion globally in 2005, and are projected to grow at a compound annual growth rate of 18 percent over the next five years.

The report, titled "Global Semiconductor Packaging Materials Outlook - 2005 Edition," covers laminate substrates, flex circuit/tape substrates, leadframes, bonding wire, mold compounds, underfill materials, liquid encapsulants, die attach materials, solder balls, wafer level package dielectrics and thermal interface materials.

The report identifies important technology and business trends affecting the packaging materials market, as well as opportunities for suppliers.




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