Cellphone chipset combines NAND, DRAM

Micron Technology Inc., a provider of memory and image sensor solutions, announced its new line of multichip package (MCP) memory for use in cellphones. The MCP combines Micron's NAND flash memory and mobile DRAM.

"To meet the market's increasing demand for high density, small form factor, and low power devices, it's a natural evolution for Micron to further support the industry by creating a NAND and DRAM packaging combination," said Achim Hill, senior director marketing for Micron's mobile memory group.

The high-density NAND and mobile DRAM MCP devices are currently sampling to select customers, and are expected to be available in 1Gb NAND/512Mb mobile DDR DRAM configurations for production in Q4 2006.