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SEMI publishes 14 new semicon, FPD, MEMS technical standards

Posted: 15 Feb 2006 ?? ?Print Version ?Bookmark and Share

Keywords:SEMI? semiconductor? flat panel display? MEMS? micro-electromechanical systems?

SEMI has published 14 new technical standards applicable to the semiconductor, flat panel display (FPD) and micro-electromechanical systems (MEMS) manufacturing industries. These new standards, developed by technical experts from equipment suppliers, device manufacturers and other companies participating in the SEMI International Standards Program, are available for purchase in CD-ROM format or can be downloaded from SEMI's website.

SEMI Standards are published three times a year. The new standards, part of the February 2006 publication cycle, join more than 720 standards that have been published by SEMI during the past 32 years.

The standards include a specification for round 200mm polished monocrystalline gallium arsenide wafers, a test method for determination of particulate contamination from minienvironments, and a specification for job deck data format for variable shaped beam (VSB) mask writers.

"These new specifications, which include several applicable to the emerging growth area of compound semiconductors, will help reduce the industry's manufacturing costs and speed time-to-market," said Bettina Weiss, SEMI director of International Standards.

The SEMI Standards Program, established in 1973, covers all aspects of semiconductor process equipment and materials, from wafer manufacturing to test, assembly and packaging, in addition to the manufacture of flat panel displays and MEMS.

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