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New tech seminars, new chances

Posted: 01 Mar 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Echo Zhao? Abbon Yan? IIC-China? ESC-China?

IIC-China and ESC-China technical seminars have attracted the eager participation of China's engineers. This year's seminars will be held in Shanghai, Shenzhen and Beijing in three formssummit, keynote address and vendor seminar.

For the summit seminar, senior executives and industry experts are invited to discuss the IC industry's development trend this year. Moreover, they will discuss with design engineers and technical managers the challenges of China's electronics industry in 2006. The keynote address will provide an opportunity for deeper discussion of industry prospects among company presidents in China and abroad, designers, and media and industry analyzers. The vendor technical seminar will provide detailed product information for engineers.

Industry hits
This year's summit topics are industry hitsthe design technology for 3C fusion applications, automotive electronics, digital consumer electronics, power management, embedded systems, EDA tools, wireless communication and wideband access.

Freescale Semiconductor, Philips Semiconductors, Analog Devices and Texas Instruments will jointly give a lecture at the Shanghai summit seminar. Mobile entertainment has been the key driving source for wireless communication's future growth. Hence, the line between traditional terminal products is getting blurrya mobile phone can be a camera, MP3 player and remote control; a PC can become a gateway for managing entertainment equipment and security systems.

Topics include mobile entertainment's requirements for IC technologies, including a proper balance of speed, security, compatibility and power consumption. Near-field communication technologies, long-distance communication of intelligent consumer products and consumer living room entertainment control will also be topics, as part of 3C fusion.

VIPs from Atmel and International Rectifier Co. Ltd. will be at the Shenzhen summit to discuss issues such as privacy protection and power management. Topics include privacy protection in 3C fusion, its development speed, proposals for smart-card technology adoption, an Internet information-protection standard called PKI, 3C fusion design requirements, power-management technology trends and the future power product structure.

Altera and Renesas Technology will also be at Shenzhen to talk about 3C's low-cost solutions, shorter development periods, improving productivity and profitability, future 3C products using programmable logic technology and the ubiquitous era.

ST, ARM and TI companies will give lectures at the Beijing summit seminar. A lecture will be given by Frederick Fu, president at ST Asia-Pacific, on the trend of 3C fusion aggravating related power-management issues. Tan Jun, president in charge of China business for UK ARM Corp. will discuss system integration of 3C fusion products, particularly in 3G handsets.

Senior executives from IR, Freescale and Philips will give keynote addresses on the industry's current situation and its development.

- Echo Zhao and Abbon Yan
Electronic Engineering Times-China

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