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RapidIO association hails group's interoperability testing

Posted: 03 Mar 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Freescale? Texas Instruments? Tundra Semiconductor? Xilinx? RapidIO?

Applauding the efforts of Freescale Semiconductor Inc., Texas Instruments Inc., Tundra Semiconductor Corp. and Xilinx Inc., the RapidIO Trade Association hailed the group's demonstration of first-level interoperability testing.

The interoperability tests build on the trade association's RapidIO Interconnect Specification Device Interoperability and Compliance Checklists, 1.3 Spec, which was developed for ecosystem members as a guide in developing their products.

"Working as a team, RapidIO ecosystem members have delivered a clear and powerful message: market leaders are determined to ensure the tools needed for OEMs to create and build systems leveraging the wide range of RapidIO products on the market are readily available," said Tom Cox, executive director of the RapidIO Trade Association.

According to the team involved in the project, technology experts created multiple levels of Interoperability checklist items. The first level of device interoperability tests ensures "Device A" is proven to pass a given test with "Device B." The subsequent group of checklist items focuses on RapidIO Specification compliance. Building on this work, the team's long-term goal is to partition device interoperability and specification compliance tests into multiple levels of tests, each building off of the other, said the press release.

Lakshmi Mandyam, segment marketing manager for Freescale's digital systems division, said, "With more RapidIO capable silicon products interoperating in deployed systems, it's increasingly important for our customers to have confidence that the devices work together as specified. That's why this interoperability work is so important."

A wide range of RapidIO silicon and products is already available, including semiconductors (DSPs, microprocessors, switches, FPGAs, ASIC library support), software (processor and DSP RTOS support), and boards and modules (ATCA carrier cards, AMC modules for DSPs, processors). As products proliferate, OEMs expect RapidIO Trade Association members to ensure interoperability so they can design systems with certainty.

"Serial RapidIO is real today, with all the pieces in place to ease development of high performance multi-processing systems for video, imaging and communications," commented Leon Adams, worldwide marketing manager, Catalog DSP, TI. "Thanks to Serial RapidIO, it's never been easier to build multi-processing, multi-channel signal-processing solutions."

RapidIO is an established, scalable, open-standard, switched fabric, designed by the leaders in embedded computing specifically to deliver the reliability, cost-effectiveness, performance and scalability required by OEMs building equipment in the wireless infrastructure, edge networking, storage, scientific, military and industrial markets. The RapidIO Trade Association brings together the right ecosystem to help developers build embedded systems using the RapidIO architecture, said the press release.




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