Interface IC supports next-gen video in cellphones

Texas Instruments Inc. (TI) introduced a new family of interface ICs for true-color, high-resolution video content in handheld electronics. The new FlatLink3G serializers and deserializers provide a high-speed interface between LCD and mobile application processors. The sub-low voltage differential signaling (subLVDS) serializers transmit true 24bit red/green/blue (RGB) color data and support screen resolutions from QVGA through XGA, including VGA.

"Consumers today can download TV shows to their cellphones, but existing interface technology limits the display quality," said David Mulcahy, TI's high-speed interface marketing manager. "The FlatLink3G family provides the bridge from processor to display panel that allows designers to take full advantage of newer, higher-resolution screens such as VGA and lets end users enjoy a palette of 16 million colors."

The SN65LVDS301 transmitter supports current and future screen resolutions in cellphone displays. Designers are able to select one, two or all three of the device's serial subLVDS channels, allowing them to develop with the same chipset for resolutions from QVGA through XGA, including VGA.

Supporting signals of up to 150mV swing on the transmitter, the LVDS301 is said to reduce 27bits of data to one, two or three channels, depending on the application. The low-swing serial signal helps reduce EMI. With a noise floor around -105dBm and spurs below -95dBm, the EMI of the LVDS301 is extremely low, the company said.

The LVDS301 offers several features such as bus swap, which allows more flexibility in board layout and assembly. In addition, the devices' parity check feature aims to assist designers in finding errors while testing their design.

FlatLink3G devices are compatible with display modules and driver ICs available from manufacturers such as Himax Technologies, Hitachi Displays, Renesas Technology LCDBU, Samsung SDI and Sanyo Epson Imaging Devices.

The SN65LVDS301 transmitter IC is sampling now in a 5-by-5mm MicroStar Junior BGA package. It will be available in volume in Q2 2006, priced at $2.10 in 1,000-unit quantities. Support for designers will include IBIS models. TI will introduce the three-channel receiver, as well as one- and two-channel transmitters and receivers in the FlatLink3G family in 3Q 2006.