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Solder flux designed for tin-lead, Pb-free processes

Posted: 09 Mar 2006 ?? ?Print Version ?Bookmark and Share

Keywords:ALPHA EF-6100? solder flux? Cookson Electronics Assembly Materials?

ALPHA EF-6100 solder flux

Cookson Electronics Assembly Materials (CEAM) has launched the ALPHA EF-6100 low-solids wave solder flux. It is the latest addition to its EF series of environmentally-friendly fluxes designed for new Pb-free processes as well as tin-lead processes. This alcohol-based flux is said to have passed international reliability standards including IPC, Bellcore and JIS.

According to CEAM global product manager Steve Brown, the product offers low residue for board cosmetics and pin-testability for lead-free and tin-lead applications.

The company claims that ALPHA EF-6100 leaves minimal colorless, non-tacky, clear flux residue that spreads uniformly over the surface of PCBs. It provides resistance to connector bridging across a range of process conditions. It is compatible with common pad finish types and is said to improve yield by reducing defects, minimizing rework and increasing throughput.

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