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Adhesives feature low CTE

Posted: 13 Mar 2006 ?? ?Print Version ?Bookmark and Share

Keywords:AAA2300? AAA2301? AAA2303? die attach adhesives? Advanced Applied Adhesives?

Advanced Applied Adhesives announced the availability in production quantities of a new series of electrically insulating die attach adhesives that is said to feature a low coefficient of thermal expansion (CTE) that aims to reduce CTE strain. Designated AAA2300, the series is comprised of AAA2300, AAA2301 and AAA2303.

AAA2300 is suitable for pyramidal-die-stack on bleed-prone nitride passivated die that is without polyimide final passivation. The silica filler in AAA2300 has been proven to not damage the bottom die even without the polyimide buffer layer, said the company.

The lower CTE AAA2301 and AAA2303 are for same-die-stack applications requiring a gap filling bondline in place of a dummy die. The materials fill the gap all the way to the die edge to provide support to the top die for wire bonding. The low CTE of the materials is said to protect bonding wires from breaking in temperature cycling and thermal shock.

Each adhesive in the series is solvent-free and will cure to a void-free bondline in a fast ramp, snap cure oven or in a box oven for batch processing.

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