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SMIC to employ UltraFLEX system for high volume wafer testing

Posted: 22 Mar 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Teradyne? Semiconductor Manufacturing International? SMIC? foundry? UltraFLEX?

Teradyne Inc. disclosed recently that Semiconductor Manufacturing International Corp. (SMIC), one of the leading foundries in the world, has selected its UltraFLEX test systems for high volume wafer testing. The UltraFLEX systems will be used for device test applications, including performance audio, baseband, HDTV, high-speed communications, datacom and embedded memory products.

The UltraFLEX test system is designed to meet next-generation device test requirements while incorporating FLEX architecture features like the Sync-Link synchronization technology for complete parallel control of instrumentation in multiple time domains, and Background DSP processing that eliminates test time penalties for data analysis. According to the press release, the FLEX architecture provides streamlined multi-site test in production so customers can achieve optimum test economics.

"The UltraFLEX test system is a perfect match for SMIC's leading device technologies," said Si Wei, vice president of Teradyne Semiconductor Test Field Operations, Greater China Region. "The system is designed for high performance and extremely broad coverage provided by instruments such as the TurboAC Broadband AC Instrument. UltraFLEX delivers the flexibility and time to market features that integrated circuit manufacturers require to be competitive and achieve great test performance. Our China-based customer support team looks forward to continue working with SMIC as UltraFLEX is deployed to test their next-generation of advanced devices."

Teradyne's FLEX Test Platform advances test technologies in a test architecture designed for high-efficiency, multi-site test. This platform offers multiple systems so customers can optimize for performance, capacity and capital cost to achieve lower cost-of-test. The FLEX Platform systems span test requirements from DFT and structural test to standard analog and mixed-signal to the latest high-integration SoC and System-In-Package devices for consumer, automotive, mass storage, wireless and data communications applications.

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