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New material eases thermal management

Posted: 22 Mar 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Honeywell PCM45F-SP? phase-change material? thermal management? Honeywell Electronic Materials?

Honeywell Electronic Materials has announced the release of a new screen-printable phase-change material that aims to provide semiconductor chip manufacturers flexibility in thermal management.

According to the company, manufacturers have been limited by the shape of phase-change materials supplied in traditional tape formats. This new product, called Honeywell PCM45F-SP thermal interface material, allows manufacturers to apply it in different shapes to conform to the semiconductor chip design, also known as the screen print of the chip.

Thermal management is said to be a critical issue for the semiconductor industry as manufacturers seek to dissipate the high amount of heat generated by today's high-powered chips; otherwise these chips will not last long or will cease to function altogether.

Honeywell said their materials either conduct the heat away from the chip to some other area or provide means by which heat is dissipated into the surrounding air. Phase-change materials are heat conductors that change from solid to semi-solid or liquid state. This allows the material to fill micro-gaps between itself and the chip, thereby diffusing heat from the latter more efficiently. Phase-change materials used to be available only in tape format and were supplied in rolls. Small pads of these phase-change materials were then affixed during the semiconductor packaging process.




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