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MEMS tester works at wafer level

Posted: 10 Apr 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Temeon? microelectromechanical system? MEMS tester? Tokyo Electron?

Tokyo Electron Ltd (TEL) has delivered the Temeon, a new wafer-level microelectromechanical system (MEMS) tester to a MEMS device manufacturer located in Japan. The system is said to enable manufacturers to stimulate a MEMS device, and isolate and validate the electrical and mechanical functionality at the wafer level prior to packaging.

TEL said that the new product contains improvements in advanced MEMS testing technology. The first is in the area of fault coverage. The company revealed that in today's MEMS test arena, manufacturers are only able to test electrical functionality at the wafer level. With the Temeon, customers may now test the mechanical structures of the MEMS device as well as the electrical performance.

Optimization of the test setup and the testing process is the second enhancement. TEL has implemented a low force contact methodology at the wafer level. This low force process aims to eliminate any adverse effects to wafer yield due to strain applied to MEMS structures that may alter the performance.

MEMS devices are typically manufactured using semiconductor process technologies such as photolithography or etching. TEL said that standardized technology allows devices to be manufactured at low cost with small features and low power consumption that is difficult to obtain in standard electromechanical systems. These factors are said to be fueling high market growth in consumer segments, such as handheld devices and automotive products.




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