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Winbond opens 12-inch fab

Posted: 25 Apr 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Winbond? 12-inch? fab? Central Taiwan Science Park? semiconductor?

Winbond Electronics Corp. official opened its new 12-inch fab at the Central Taiwan Science Park last week. Guests included National Science Council Deputy Minister Hung-Duen Yang, Central Taiwan Science Park Provisional Office Deputy General Director Wen-Ke Yang, Taichung County Magistrate Chung-Sheng Huang, and Taichung City Deputy Mayor Jia-Qi Hsiao.

According to Winbond, the opening of the new fab marks its official entry into the arena of 12-inch volume production. The NT$49 billion project broke ground in July 2004, was pilot-tested in September 2005, and will start mass production in Q2 2006. Major products to be manufactured in the 12-inch fab are specialty DRAMs and Pseudo SRAMs. Part of the fab's capacity shall be used for DDR2.

The plant has two sections: Fab A, with a current capacity of 8,000 wafers per month but will increase to 24,000 wafers by end 2006; and Fab B, also with a capacity of 24,000 wafers per month and will start operation after Fab A reaches its maximum capacity.

Winbond will use advanced process technology in its new fab to meet product development demands. The 0.11?m process technology has already been implemented, to be followed by the 0.09?m.

The new fab at the Central Taiwan Science Park is Winbond's fourth. Its 6-inch fab, with a capacity of 50,000 wafers per month, mainly manufactures logic product ICs, while its two 8-inch fabs, with capacities of 40,000 wafers per month, make memory products.

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