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Systems approach delivers SiP design

Posted: 01 May 2006 ?? ?Print Version ?Bookmark and Share

Keywords:mamoru kajihara? han park? nec? sip? soc?

System-in-Package isn't just about size. Boasting faster development and lower cost, SiP allows the combination of different wafer process chips in one solution, making it not only a package but also a true system.

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