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Yamato unveils N2 reflow oven for 200-300mm wafers

Posted: 31 May 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Yamato? NRY-130V6W/LU? nitrogen reflow oven?

Yamato Works Co. Ltd has rolled out the NRY-130V6W/LU nitrogen reflow oven for solder bump forming for 200-300mm wafers.

This equipment's heating system employs a combination of the hot plate and the upper far-infrared heater. The hot plate uses the pins-supported heating mechanism to take in warped wafer. Maximum temperature for the hotplate is 390C while for the far-infrared heating it is 500C.

According to the company, its unique pin design is used for hot plates at the preheat zone, allowing a two-staged heating. This combination heating, unlike forced convection heating, improves cleanliness in the furnace and can keep lower oxygen density (less than or equal to100ppm).

In the furnace, wafers are transferred by the company's own walking beams transfer system using tact sending. Wafers are loaded and unloaded by two three-axis clean robots, allowing very clean and accurate wafer transfer, the company said. Optional components such as flux dispenser and spin coater can be built in the reflow over.

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