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FlipChip, Engent to develop 3D wafer level CSP tech

Posted: 31 May 2006 ?? ?Print Version ?Bookmark and Share

Keywords:3D wafer level CSP? stacked die packaging? FlipChip? Engent?

FlipChip International and Engent announced an alliance aimed at accelerating the development and deployment of 3D wafer level CSP technologies for stacked die packaging applications. This technology could enable packaging solutions that are quicker to market and cheaper than SoC alternatives.

The partnership combines FCI's wafer bumping capabilities and 2D Wafer Level CSP package portfolio with Engent's surface mount and flip chip assembly technology. The technology platform emerging from this partnership supports high volume IC packaging applications including silicon-on-silicon, GaAs-on-silicon and SiGe-on-silicon, as well as 3D integration of integrated passive device technologies and MEMS devices for system-in-a-stack solutions.

FlipChip International LLC is a privately-held supplier of products and services for the wafer bumping and wafer scale packaging semiconductor market. FlipChip is a wholly owned subsidiary of RoseStreet Labs LLC, a supplier of products and services for life science, renewable energy and homeland security markets.

Engent is a provider of electronic manufacturing and technology services. Engent's services comprise manufacturing, research, and development services for the electronics industry.

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