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Testing solder joints for Pb-free connectors

Posted: 01 Jul 2006 ?? ?Print Version ?Bookmark and Share

Keywords:George Chou? Tyco Electronics Corp.? test and measurement? reliability test? low level circuit resistance?

OEMs and contract manufacturers in the electronics industry have been accelerating efforts to replace tin-lead finishes on electronics components and tin-lead solder in interconnects with lead-free finish and solder. Test shows that solder joints constructed from lead-free solder show higher voiding content than those of eutectic tin-lead solder.

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