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Tokyo Electron unveils probe mark analyzer

Posted: 03 Jul 2006 ?? ?Print Version ?Bookmark and Share

Keywords:TEL? Tokyo Electron? TELPADS-O? probe mark inspection? PMI?

Tokyo Electron Ltd (TEL) has announced the release of its new probing accuracy diagnosis systemthe TELPADS-O. Integrated with the company's 300mm fully automatic wafer prober, the P-12XLm, the new system provides users with off-line, high speed probe mark inspection analysis.

Trends in the wafer probing market have led to an increasing number of DUT's tested in parallel for memory applications, as well as an increasing number of device pins per die in SoC applications. Inspection and analysis of the probe marks made during and after testing at the wafer level is crucial in maintaining the quality of back-end processing due to the fine pitch of bonding pads and multiple test steps.

To meet this market challenge, TELPADS-O promises throughput improvements of 50-100x compared to current probe mark inspection (PMI) capabilities. Integration with the company's fully automatic wafer prober creates an automated PMI solution that allows customers to maximize uptime of the test cell. Furthermore, the company's automated PMI methodology eliminates the need for manual inspection with a microscope, thereby reducing the need for operator interaction.

TEL said its new PMI system is also capable of providing quantitative data analysis of many probe mark parameters, resulting in enhanced process control and optimal wafer testing efficiency, including probe card quality control.

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