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X-ray analyzer eases advanced chip packaging

Posted: 06 Jul 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Xradia? MicroXCT 3D? X-ray microscope?

MicroXCT 3D Transmission X-ray Microscope

Xradia Inc. has sold three of its MicroXCT 3D Transmission X-ray Microscopes to semiconductor manufacturers for advanced packaging process development and failure analysis. Two of the systems are being deployed to fabs in the US for advanced package development and the third is headed to Asia where it will be used to examine ball grid arrays.

Combining spatial resolution below 1.5n and feature recognition of 500nm, with full 3D tomography capability, Xradia said the MicroXCT is suited for the engineering and failure analysis of next-generation semiconductor packages, including multistacked die and flip-chip architectures.

"These system sales validate the importance of high-resolution x-ray tomography as a critical new analytical tool for semiconductor manufacturing," said Dr. Wenbing Yun, founder and president of Xradia. "3D x-ray microscopy enables the non-destructive investigation of design features or process defects, thereby lowering development costs and speeding time to market," added Yun.

High resolution 3D x-ray tomography provides critical new imaging capability for semiconductor packaging, including C4 ball grid arrays, stacked die, solder bumps and packaging interconnects. Defects such as solder non-wet, cracks, voids, delamination, opens and shorts are readily imaged. New applications are also emerging for RoHS Pb-free development and vias in ceramic packaging. Xradia also manufactures microscope systems with sub-50nm resolution for chip and die-level applications.

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