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SDRAM-DDR memory unit touts multichip plastic packaging

Posted: 07 Jul 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Austin Semiconductor? SDRAM-DDR? AS4DDR1M72PBG? memory? industry standard plastic material?

Austin Semiconductor Inc. has launched its 1.2Gbit, SDRAM-DDR memory family in a 219-pin BGA. The units are produced on an organic laminate microsubstrate and then encapsulated using industry standard plastic materials (iPEM).

The multichip-die plastic packaging technology allows for highly integrated products with improved space utilization, capacitance and inductance, as well as excellent thermal properties and controlled impedance over the monolithic building block approach, according to the company.

The SDRAM-DDR (AS4DDR1M72PBG) features a total density of 1.2Gbit and organized as 16M x 72/80, fitting a footprint of 32-by-25mm. It contains a total of 219 balls which constitutes the electromechanical interface. The DDR SDRAM comes in data rates of 200-, 250-, 266- and 333Mbps and core frequencies of 100-, 125-, 133- and 166MHz.

Currently sampling are the DDR266 devices operating at full military temperature range and the DDR333 devices in the industrial temperature range. These devices will be immediately followed by the single data rate version. The 2.4Gbit DDR device will follow in late Q3 2006 within the same footprint.

The products are available with a DDR performance benchmark of 266Mbps at military temperature and 333Mbps at industrial temperature.

- Marty Gold

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