Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Manufacturing/Packaging
?
?
Manufacturing/Packaging??

Cookson, Microbonds to align technology roadmaps

Posted: 10 Jul 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Cookson Electronics? Microbonds? X-Wire? wire bonding? Plaskon?

Cookson Electronics-Semiconductor Products, a division of Cookson Group plc, and Microbonds Inc. announced a co-development project to align the technology roadmaps of Microbonds' insulated wire bonding technology known as X-Wire technology, with the Plaskon molding compounds of Cookson Electronics-Semiconductor Products.

The X-Wire technology insulates gold and copper bonding wires used to connect the silicon die with the package device. The joint technical effort between the Plaskon family of mold compounds and X-Wire technology aims to provide common customers with wire bond and package molding flexibilities.

Cookson Electronics is a supplier of materials for the semiconductor packaging industry, providing integrated technology solutions for semiconductor packages in the market.




Article Comments - Cookson, Microbonds to align technol...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top