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VIA unrolls 'first' single chipset for ultra mobile PCs

Posted: 11 Jul 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Ismini Scouras? VIA? VX700? core logic chip?

Chipset for UMPC

VIA Technologies Inc. added another device to its Ultra Mobile PC (UMPC) product portfolio: the VX700 core logic chipset that integrates North and South Bridge functions into a flip-chip BGA package measuring 35-by-35mm.

Yielding a more than 42 percent savings in board real estate, the VX700 single chipset is aimed at ultra small form factor devices such as thin notebooks and portable devices that require more simplified board layouts and expanded room for additional onboard features, as well as devices that offer high levels of power efficiency. The company claims that it is the first single chipset product for UMPCs.

VIA's other key UMPC products include the C7-M ULV processor, the VN800 digital media mobile chipset, and the VT8237A advanced chipset south bridge.

The VX700 delivers a Thermal Design Point (TDP) maximum of 3.5W compared with 4.4W, the power consumption level of VIA's VN800 and VT8237A. That's a 20 percent power savings over the equivalent two-chip chipsets.

Enhanced video quality is provided through the company's UniChrome Pro II IGP graphics core that offers 128bit 2D/3D graphics. For power image enhancement technology, the VX700 chipset integrates a Chromotion Video Engine that delivers a Hi-Def visual experience, including advanced video acceleration for MPEG-2, MPEG-4, and WMV9.

The VX700 also features the company's memory controller technology that supports DDR and DDR2 memory (up to 533MHz). It also offers high-speed 533-/400MHz FSB connections to the company's C7-M and C7-M ULV processors.

The VX700 is priced at approximately $35 each.

- Ismini Scouras
eeProductCenter




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