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MagnaChip introduces CSP to CMOS sensor line

Posted: 11 Jul 2006 ?? ?Print Version ?Bookmark and Share

Keywords:CSP? chip-scale packaging? MagnaChip? image sensor? VGA?

MagnaChip Semiconductor Ltd, a designer, developer and manufacturer of image sensor solutions, mixed-signal and digital multimedia semiconductors, announced that it will introduce chip-scale packaging (CSP) to all lines of its imaging products.

According to the company, CSP allows package sizes down to nearly the size of a semiconductor die and can reduce the total final product packaged size. This technology can enable higher yields than the COB and CLCC packaging methods, which are based on conventional camera module manufacturing processes.

By attaching a cover glass directly over the surface of the sensor, the packaging method is said to help eliminate performance deterioration caused by particles introduced in the course of the module assembly process. The process aims to help save infrastructure investments in clean room technology and other facilities that are required for COB-based module assembly.

MagnaChip will provide CSP on both its VGA and megapixel products. The VGA products are already in mass production, while the megapixel products are available in sample form, with mass production quantities scheduled in Q3 2006.

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