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Microbonds rolls out evaluation kit for X-Wire tech

Posted: 12 Jul 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Microbonds? X-wire 2.0 Head Start Kit? evaluation kit?

Canadian company Microbonds Inc. has announced the release of X-Wire 2.0 Head Start Kit for bond wire diameters of 20-, 23- and 25n. Microbonds said it has developed and is licensing special insulating coatings for application to existing bare bonding wires used in the packaging and assembly of ICs.

The kit provides users with the requisite tools, materials and information to conduct a feasibility evaluation of X-Wire Technology, for its use as an interconnect option for IC packages, the company said. Insulated bond wire technology represents a material advancement and extension of the existing bare wire interconnect technology. X-Wire Technology enables the move towards smaller geometries, higher I/O counts, denser 3D packages such as stacked die, and longer interconnect wires by permitting wires to touch and cross in the x, y and z dimension.

Microbonds said it has worked in alliance with leading suppliers to the IC packaging industry over the past year as a key part of its commercialization strategy, expanding the window of compatible materials, equipment and processes and enabling a broad infrastructure to support the use of X-Wire in volume production. The company has recently announced a license in favor of Tanaka Denshi to produce X-Wire in volume, initially at its Saga facility in Japan.

"X-Wire is designed to utilize the existing low-cost wirebonding infrastructure, while providing benefits ranging from yield improvement to flexibility in IC pad layout and design. Microbonds is working closely with alliance partners on specific technical programs aimed at ensuring immediate compatibility with adjacent processes such as wire bonding equipment, capillaries, plasma cleaning and transfer molding," said Robert Lyn, founder and CTO of Microbonds. "Long term development programs focus on aligning technology roadmaps to jointly create innovative processes that fully exploit the value of insulated bond wire."

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