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Digital AM/FM tuner offers high-quality reception

Posted: 13 Jul 2006 ?? ?Print Version ?Bookmark and Share

Keywords:ST? STMicro? TDA7528? STA3005? radio receiver?

AM/FM radio receiver chipset

STMicroelectronics has announced the sampling of a new digital AM/FM radio receiver chipset for use in automotive applications. The company said advanced digital signal processing techniques allow the chipset to feature high-quality reception while reducing interference even in the presence of challenging signal conditions such as weak field and strong multipath (reflection from mountains and buildings).

Jointly developed by ST and Bosch's subsidiary Blaupunkt, this digital receiver integrates audio signal processing and Radio Data System (RDS) decoding, thus satisfying the demanding needs of today's mid- and high-end car radios for quality, high performance and system cost optimization, the company said.

The new chipset includes two TDA7528 RF front-end ICs and one STA3005 DSP back-end IC. The solution tunes to current analog radio services worldwide (AM, FM and US Weather band) as well as recently introduced digital broadcasts (Digital Audio Broadcasting, Digital Radio Mondiale, HD radio), providing suitable interfaces to external decoders.

According to ST, an advanced digital audio processor, powered by an the company's own DSP core, enhances the system's flexibility and efficiency, thus meeting the needs of in-vehicle sound processing and equalization. Additionally, an embedded ARM7 microcontroller supervises all the internal peripherals, reducing the workload and software complexity of the car radio's main microprocessor and fully supporting RDS managementa must-have of today's car-radios.

"The chipset is the first member of a new digital tuner family that will cover the full range of application needs, from mid- to high-end car radios," said Domenico Rossi, general manager for car-radio and multimedia at ST's Automotive Product Group.

The TDA7528 and STA3005 are supplied in LQFP64 (10-by-10mm) and TQFP144 (20-by-20mm) ECOPACK packages, respectively. Samples of the chipset are currently available and volume production is scheduled for Q2 2007.

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