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ESI unrolls 'first' multiple-beam IR laser system

Posted: 13 Jul 2006 ?? ?Print Version ?Bookmark and Share

Keywords:ESI? Model 9850? IR laser link-processing system?

Laser systems provider ESI Inc. has introduced Model 9850, a dual-beam IR laser link-processing system for DRAM and NAND Flash memory applications. According to the company, the 9850 features an innovative architecture that utilizes two beams from a single laser to enable parallel processing, touted to be first such capability in the industry.

This new processing approach enables potential throughput improvements of up to 90 percent over the conventional laser repair systems, ESI said, and improves cost of ownership by providing more productivity with no additional maintenance or floor space. The company added that it has developed this unique laser architecture to meet the increasing demand and ramp for leading-edge DRAM devices.

With the new beam-positioning strategy that enables the processing of many fuse design configurations at high speeds, ESI shared that the 9850 represents the first generation the company's multiple-beam processing systems.

"The 9850 was designed to enable customers to ramp production for 1Gbit DRAM, and 2- and 4Gbit NAND Flash memory applications," said Paul Kirby, ESI's director for semiconductor link processing solutions. "However, this is just the first step in determining the many applications for our new architecturewe will be further developing this platform for other wavelengths and other laser types that stand to reap significant benefits from the dual-beam approach."

The 9850 system processes tight-pitch metal fuses on the latest generation of DRAM and NAND Flash devices. Enabling whole-wafer processing with half the number of link runs, it was designed for high-throughput, automated 300mm production environments. In addition, said ESI, the software automatically optimizes dual-beam processing for maximum throughput advantage.




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