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System enables fully automated inspection of 300mm wafer surface

Posted: 20 Jul 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Vistec? LDS3300? wafer inspection system?

LDS3300 wafer inspection system

Vistec Semiconductor Systems (previously Leica Microsystems Semiconductor GmbH) announced that its new-generation LDS3300 enables fully automated inspection of the complete 300mm wafer surface. This breakthrough is possible through an innovative solution for wafer edge and backside inspection, the company said.

The system's parallel processing capability allows simultaneous wafer inspection of the front/backside and the edge/bevelat throughputs of up to 130 wafers per hour. A single rotation of the wafer is sufficient for wafer edge inspection to deliver the detection results and defect images. The image-based technology features 1m sensitivity and allows for optional high resolution microscopic review of defects.

The system's intelligent high-resolution detection function, the company said, enables process problems (for litho, CMP, etch and other applications) to be quickly and automatically detected then analyzed with the review function. The efficient detection methods and algorithms enable easy differentiation between acceptable process variations and real defects, the company explained.

The results are delivered in color, as full wafer images and high-resolution single defect images. "The color detection and color defect images are what make the LDS3300 unique," explains Thomas Groos, senior product manager.

In addition, Vistec said the system has a specially developed illumination system with variable illumination angles for optimal adaption to different applications, such as defocus detection or CMP scratches. The modular configuration of the combined "micro-macro" system promises perfect adaptation to current and emerging process requirements. The substantially shorter per wafer inspection timeat the highest sensitivityleads to significant improvements in cost of ownership compared to manual inspection and stand-alone solutions.

The system's various integrated detection principles achieve the best results for a range of applications. "This means we are already able to meet future ITRS roadmap specifications today," said Groos.

Last year, Vistec has conducted extensive beta-site evaluations with leading customers in Asia, USA and Europe. The LDS3300's efficient performance under full production conditions resulted in numerous orders from leading semiconductor manufacturers.

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