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Spansion expands manufacturing agreement with TSMC

Posted: 25 Jul 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Spansion? TSMC? Taiwan Semiconductor Manufacturing Co.? manufacturing agreement? MirrorBit?

Spansion Inc. announced that it has expanded its foundry manufacturing agreement with Taiwan Semiconductor Mfg Co. (TSMC) to include Spansion's 90nm MirrorBit technology on 300mm wafers.

According to the expanded agreement, TSMC will phase Spansion's 90nm process technologies into its production lines exclusively for use in Spansion's products. To help Spansion meet the growing demand for its MirrorBit technology, TSMC has been producing Spansion Flash memory wafers at 110nm MirrorBit technology since Q2 2006. The target production ramp for 90nm MirrorBit technology is second half of 2007.

The new capacity will augment Spansion's internal production capabilities, including 90nm MirrorBit capacity at its Fab 25 facility in Austin, Texas, transitioning to 65nm MirrorBit technology in 2007; 110nm MirrorBit capacity at its JV3 facility in Aizu-Wakamatsu, Japan; 45nm MirrorBit production capacity planned on 300mm wafers in mid 2008 at the new SP1 facility in Aizu-Wakamatsu. SP1 can also start 65nm MirrorBit technology production in 2007, depending on market conditions.

"Demand for our MirrorBit products is strong," said Jim Doran, COO of Spansion. "By expanding our agreement with the leading foundry supplier we gain additional flexibility in our business and can align our manufacturing capacity to fluctuating demand. This allows us to maintain a steady supply to customers while ensuring maximum operational efficiency."

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