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Heat sinks cool BGA components

Posted: 25 Jul 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Advanced Thermal Solutions? ATS? heat sink? EX2? Gina Roos?

ATS' EX2 heat sink

Advanced Thermal Solutions Inc. (ATS) has introduced a low-profile, high-performance heat sink designed for cooling BGA components in low airflow velocity conditions.

The EX2 heat sink measures 9mm in height, which allows its use inside enclosures where space is limited. This device offers a case-to-ambient thermal resistance of 1.8C/W within an air velocity of 600ft/min. It weighs 16g and can be securely attached to a component with double-sided, thermally conductive adhesive tape. Since no mechanical hardware is needed, said the company, weight and assembly time are reduced and it saves board space.

Pricing for the EX2 heat sinks starts at less than $8 each in volume orders.

- Gina Roos
eeProductCenter




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