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Master Bond launches adjustable mix ratio adhesive

Posted: 31 Jul 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Master Bond? EP21? epoxy adhesive?

Macro Bond epoxy adhesive

Master Bond recently announced it has developed a two-component, room temperature curing epoxy adhesive called EP21. The company said Polymer System EP21 has the unusual characteristic of allowing an adjustment of the properties of the cured system by altering the mix ratio. Adding more A part (e.g., 2:1 mix ratio) gives a more rigid cure while adding more B part (e.g., 1:2 mix ratio) gives a more yielding cure.

EP21 promises strong and durable bonds that hold up well to thermal cycling and resist many substances including water, oils, fuels, acids, bases and salts. It operates over the wide temperature range of -60F to 250F. It bonds well to a variety of substrates including metals, glass, ceramics, wood, rubber and many plastics and has excellent gap filling properties, the company said. Once cured, EP21 promises excellent electrical insulation. Zetex said this versatile system can be used in the electronic, electrical, computer, metalworking, appliance, automotive, chemical and other OEM industries. The cured adhesive meets the requirements of MIL-A-81236 (OS) and MMM-A-187B among others.

EP21 is 100 percent reactive and does not contain any diluents or solvents. While the standard color of the cured material is gray, a wide variety of additional color choices are also available. It is available in pint, quart, gallon and 5-gallon pail container kits.

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