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AC process streamlines Pb-free flip-chip assembly

Posted: 31 Jul 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Henkel? non-conductive paste? encapsulant? Hysol FP5000? Hysol FP5001?

The electronics group of Henkel has introduced a new process, designated as Accelerated Cooling (AC), to be used in combination with the company's two flip-chip in package non-conductive paste (NCP) underfill encapsulants, which is said to reduce warpage, eliminate voids and cut cycle time in the lead-free flip-chip assembly process.

Henkel's NCP materials, Hysol FP5000 and Hysol FP5001, provide an alternative to traditional, mechanical soldering by bonding bumps to the substrate through a Pb-free compatible thermal compression process, which simplifies flip-chip assembly by eliminating the need for flux application, reflow and cleaning in most cases, said the company. Specifically designed for use with Pb-free interconnects, the Hysol FP5000 and Hysol FP5001 materials are said to provide superior moisture resistance and excellent thermal cycling resistance.

Henkel said the effectiveness of these materials is enhanced through the use of the company's patent-pending AC flip-chip assembly process. Unlike conventional thermal compression processes where the NCP material is applied onto the substrate and subsequent heating and compressing of the device occur, Henkel's AC process heats the device while it is secured by the flip-chip bonder head and then is rapidly cooled during compression onto the NCP-coated substrate.

It's this rapid cooling process that is said to enable assembly completion prior to any excess heat exposure and as a result reduces package warpage, voids caused by moisture and assembly cycle time. Whereas typical cycle time including IC alignment may take as long as 13s, the AC process cuts this by nearly 50 percent for a 7s cycle time, according to the company.

Henkel also recently qualified a Green mold compound and die attach material set for 14- and 16-lead SOIC packages used in Pb-free manufacturing processes.

- Gina Roos
eeProductCenter




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