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SiP tech stacks logic, gigabit-class memory in one package

Posted: 03 Aug 2006 ?? ?Print Version ?Bookmark and Share

Keywords:NEC Corp.? NEC Electronics Corporation? SiP? SMAFTI?

NEC Corp., NEC Electronics Corp. and NEC Electronics America Inc. unveiled a new system-in-package (SiP) technology capable of stacking logic and gigabit-class memory in a single package to enable high-speed, high-definition image processing in mobile devices.

The new SiP technologySMArt connection with Feed-Through Interposer (SMAFTI)features a 3D chip connection whose approximately 60m gap and 50m-pitch microbump between the logic and memory devices can support transmissions up to 100Gbps. Designers who use SMAFTI technology in cellular phones and other portable equipment that have stringent size and power constraints can achieve resolutions comparable to those achieved in high-definition television.

"System-on-chip technologies present a disadvantage in terms of development cost and memory capacity, while conventional SiP products have larger package sizes due to thicker interposers, and have limitations in signal transfer speed, wire-bonding interconnections, and side-by-side chip placement," said Takaaki Kuwata, general manager, advanced device development division, NEC Electronics. "The new SMAFTI technology successfully resolves these issues and enables engineers to effectively design and manufacture high-performance systems for mobile electronic devices."




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