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Intel rolls out NOR flash memory for low-cost handsets

Posted: 04 Aug 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Intel? NOR flash memory?

Intel Corp. has introduced its first NOR flash memory products aimed at the emerging low-cost cellphone segment. According to the company, the new products have a new pin sharing package to minimize pin count and are configured to work with low-cost, single-chip baseband and RF solutions from leading chipset suppliers. Major handset vendors are expected to start introducing low-cost cellphones based on Intel flash products this quarter, the company said.

Intel is introducing these products in response to increasing market demand for low-cost phones. The cellphone industry's GSM Association estimates that only 20 percent of the world's population use cellphones, largely because of cellphone costs.

"Our handset customers can choose from a comprehensive menu of NOR flash memory products from 32Mbit density at the low end to 1Gbit density for multimedia cellphones," said Darin Billerbeck, VP and general manager of Intel's Flash Products Group. "We view the low-cost handset market segment as an ongoing growth opportunity and we have a migration path in place to transition our products from 130nm and 90nm process technology to 65nm process technology in 2007."

Intel's products for the low-cost handset market segment feature cost-efficient, lower density NOR flash memory products from 32Mbit to 256Mbit with optional RAM in a multichip package. These products include a common 88-ball QUAD+ package with an address-data multiplexed (A/D Mux) configuration that simplifies the design-in process, Intel said, enabling faster time-to-market and lower design costs. These memory solutions are expected to evolve to also support the common 107-ball x 16C package with an A/D Mux configuration. To enable accelerated design cycles, Intel offers a portable Low-Cost Handset Design Kit, which includes a design guide, product datasheets and migration guides, at the company's website.

Available in both single-chip and multi-cell packages, the products are currently sampling to customers and will be in volume production in Q3 this year.

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