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Automatic die bonder offers increased precision, accuracy

Posted: 07 Aug 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Palomar? Model 3500-III? automatic die bonder?

Automatic die bonder from Palomar

Palomar Technologies has released the latest version of its automatic die bonder?Model 3500-III. Designed for fully automatic, high accuracy precision microelectronics assembly, the company said this computer-controlled work cell performs adhesive dispense, component placement, die attach and flip chip operations over a 720inch2 work area. Applications include flip chip, stacked die, chip-on-board, fine pitch SMT, MEMs devices, multichip modules, microwave modules, optoelectronic modules and hybrid microcircuits.

The new die bonder is capable of performing automated eutectic die attach using backside metalized die or preforms, and enables bonding of thin die with air bridges using 2 or 4 sided perimeter collets, the company said. Palomar said its patented eutectic process is key for high yield and reliability because eutectic die attach is one of the most difficult processes to control. The company's pulse heat process controls the heat throughout the entire process from temperature ramp up to cool-down.

Using look-up and look-down cameras for flip chip applications and relative-to referencing for linear micro-strip line placement, the die bonder's sub-micron axis resolution yields typical placement repeatability of at lease 12n, 3 with fluids, 5n, 3 with pulse heat eutectic applications.

The system uses a Windows XP, employing Cognex Corp.'s latest Series 8000 gray-scale pattern recognition systems. The graphical, user-friendly interface assists in bonding set-up, operation, diagnostics and calibration. The new, high-visibility flat screen displays on the 3500-III improve the unit's ergonomics. It is SMEMA compatible and can be configured with loaders to provide small island operations or complete in-line system solutions. From wafer to eutectic die attach, handling options are fully programmable.

"The Model 3500-III is a workhorse machine, yet it is the most flexible, precise, accurate die bonder available," said Bruce Hueners, president of Palomar, in a statement. "It has been referred to as the 'Swiss Army Knife' of bonders."

Customers seeking to extend the service life and increase productivity of their Model 3500-II can now order a 3500-III upgrade directly from Palomar and achieve the same level of reliability and productivity as a new Model 3500-III. The upgrade includes a faster 32bit computing system, Windows XP, faster and more versatile Cognex 8000 Pattern Recognition system, energy-efficient space-saving flat panel displays, and a suite of powerful software tools featuring Bond Data Miner (BDM), which includes improved process development tools, automated SPC data documentation and component traceability.

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