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Aries' BGA-to-BGA adapter addresses soldering issues

Posted: 14 Aug 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Aries? ball grid array? BGA-to-BGA? adapter?

Aries Electronics announced it is now offering a BGA-to-BGA adapter that resolves soldering issues that arise when BGA devices with RoHS-compliant solder balls are assembled with other devices whose connections are not Pb-free.

This adapter solves solder joint reliability problems that occur when the lower reflow temperatures used for standard Sn-Pb eutectic solder balls cause the incomplete reflow of the Pb-free solder balls. The lower temperatures may also be required to avoid damaging the PCB and other components on the board.

Because the body for the BGA-to-BGA adapter is made from RoHS-compliant, high-temperature glass-reinforced material, Pb-free components can be mounted to the new adapter using the necessary higher temperatures. Then, since the adapter is terminated with eutectic Sn-Pb balls that have standard reflow temperature profiles, the assembly is mounted to the Pb-Sn PCB using standard temperatures, thus resolving solder mismatch concerns. The adapter's finish is 3-8 microinches of gold over nickel (ENIG) with a red solder mask.

As with all Aries adapters, the new device is available in custom materials, plating, sizes and configurations to suit specific customer applications.

Pricing for the BGA-to-BGA adapter ranges from $5 to $15 each, depending on the ball count and the quantity required. Lead time is three to four weeks.

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