Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Manufacturing/Packaging

Solution enables high-speed 25m backside wafer coating

Posted: 18 Aug 2006 ?? ?Print Version ?Bookmark and Share

Keywords:DEK? backside wafer coating process?

DEK recently announced it has developed a next-generation equipment and tooling package that enables the coating of wafers with ultrathin die attach materials down to 25m in thickness.

Traditional dispensing methods and paste die attach processes have manufacturing challenges such as the inability to achieve emerging units per hour (UPH) requirements, limitations on chip footprint due to chip fillet formation and resin bleed, and inherent quality and reliability issues resulting from insufficient or uneven adhesive coverage. DEK said its new system eliminates these issues, allowing a speedy, highly accurate and uniform deposition of die attach materials as thin as 2525m with tolerances of 7m using a printing process.

Utilizing a Micron-class Galaxy mass imaging system, a DEK-engineered ultraflat pallet, a die attach stencil or screen, and a specially designed squeegee, the company said its backside wafer coating process enables ultrathin, precise deposits of die attach adhesive at high speed with a highly accurate and flexible screen printing platform. With this method, DEK said bondline thickness can be controlled to customer specifications, fillet control is consistent with that of traditional film products without the 20 percent to 30 percent higher cost, UPH is exponentially higher than that of dispensing, and the coated wafer can be pre-manufactured and stored until required.

The key enablers that allow the deposition of an ultrathin, 25m coating are the ultraflat pallet that provides the stability and uniformity required to process wafers as thin as 100m and up to 300mm in diameter, and the specially engineered squeegee that delicately applies the adhesive paste to the backside of the wafer.

The new process also eliminates the fillet, which subsequently reduces paste adhesive volume (potentially by a factor of ten on die less than 0.5-by-0.5mm); improves inventory control by concentrating the application of wet adhesive in the facility's dedicated print area; and streamlines the supply chain by requiring only one paste formulation for various process needs as opposed to the multiple thicknesses and widths necessary with films. This new process does not only deliver advances in die attach material applications; it can also be used for all wafer-level coating processes including epoxy and wafer-level protective backside coatings.

Because the process is run on a flexible mass imaging platform, the system can also be easily re-deployed for other packaging applications such as wafer bumping, DirEKt Ball Placement, and thermal interface material (TIM) processing and encapsulation.

Article Comments - Solution enables high-speed 25...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top