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IBM, Chartered Infineon, Samsung release update on 45nm collaboration

Posted: 31 Aug 2006 ?? ?Print Version ?Bookmark and Share

Keywords:IBM? Chartered? Infineon? Samsung? 45nm?

IBM, Chartered Semiconductor, Infineon Technologies and Samsung announced that they have developed their first functional chips based on a low-power, 45nm process technology. The four companies have been collaborating on the development of advanced process technologies as part of a major alliance.

The first working circuits in 45nm technology, targeted at next-generation communication systems, were jointly developed by the four alliance partners, they said. The chips were produced at IBM 300mm fab in East Fishkill, New York. Many of the verified blocks are standard library cells and I/O elements provided by Infineon.

The process is said to be compatible across various fabs within the four companies. "Our early hardware results indicate that the 45nm node device performance is at least 30 percent greater than that of the 65nm node, and that product developers can design to this process with confidence," said Lisa Su, vice president of semiconductor research and development at IBM and the head of the joint development alliance, in a statement.

The 45nm, low-power process is expected to be installed and qualified at Chartered, IBM and Samsung by the end of 2007. Infineon did not provide a timetable for its 45nm process. The early design kits are developed through a collaborative effort by all four companies and are immediately available for select customers.

It, however, appears that the four companies are slightly behind the competition. Earlier this year, Intel Corp. disclosed the initial details of its 45nm process and claimed that it has produced the world's first chips based on the technology. The announcement demonstrates that Intel's 45nm process is on track and expected to be ready for mass production in the second half of 2007.

Bidding to get a jump on its foundry rivals, Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) recently disclosed the first details of its new 45nm process. TSMC has pulled in its introduction date and intends to move into risk production in Q3 of 2007,

- Mark LaPedus
EE Times

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