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Manufacturing/Packaging??

Qimonda, Winbond extend DRAM agreement

Posted: 31 Aug 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Qimonda? Winbond Electronics? DRAM? 80nm? memory chip?

Qimonda AG and Taiwan's Winbond Electronics Corp. have signed an agreement to expand their existing cooperation on the production of standard memory chips (DRAMs). Under the terms of the additional agreement, Qimonda will transfer its 80nm DRAM trench technology to Winbond's 300mm facility in Taichung. In return, Winbond will manufacture DRAMs for computing applications in this technology exclusively for Qimonda.

"Our successful collaboration with Qimonda regarding the 110nm and 90nm process technology transfers has paved the way for broadening of our partnership", said Arthur Chiao, chairman of Winbond. "The expansion of the process technology transfer to 80nm is an important step to maintain close collaboration between the two companies in the future."

In May 2002 and August 2004, the two companies signed agreements on the transfer and licensing of the 110nm and 90nm DRAM-technologies for Winbond's 200mm plant in Hsinchu and 300mm plant in Taichung.




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