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Design kits ease transition to 45nm process

Posted: 04 Sep 2006 ?? ?Print Version ?Bookmark and Share

Keywords:IBM? Chartered? Infineon? Samsung? 45nm process?

IBM, Chartered Semiconductor Manufacturing, Infineon Technologies and Samsung Electronics have announced the availability of the first silicon-functional circuits and design kits based on their collaboration for 45nm low-power process technology.

The early characterization of key design elements in silicon, coupled with the availability of early design kits, provides designers a significant head start in moving to the latest process from the industry-leading CMOS technology research and development alliance, the press release said. The early design kits are developed through a collaborative effort by all four companies and are immediately available for select customers.

The first working circuits in 45nm technology, targeted at next-generation communication systems, were proven in silicon using the process technology jointly developed by the alliance partners and were produced at the IBM 300mm fabrication line in New York, where the joint development team is based. Among the successfully verified blocks are standard library cells and I/O elements provided by Infineon, as well as embedded memory developed by the alliance. Infineon has included special circuitry on the first 300mm wafers to debug the complex process and to gain experience in product architecture interactions.

"This result is another significant milestone in our successful strategy to develop optimized product solutions using the most advanced technology platforms as early as possible," stated Hermann Eul, member of the board of Infineon Technologies and president of its communication solutions business group. "The first structures in 45nm represent our most cutting-edge technology, bringing together high-performance capabilities and low-power consumption. This solution is clearly well-suited to address the needs of next-generation mobile applications."

According to the press release, the development of the design kits incorporates design expertise from all four companies in order to facilitate the earlier transition to the new process by chip customer designers, as well as continue to drive single-design, multifab manufacturing capability for maximum design leverage and to bring about ultimate consumer benefit.

The 45nm low-power process is expected to be installed and fully qualified at Chartered, IBM and Samsung 300mm fabs by the end of 2007.

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