ProMOS to invest $5B for two more 300mm fabs

Memory maker ProMOS Technology Inc. disclosed that it is planning to invest $5 billion for two more 300mm wafer DRAM fabs that will be located in central Taiwan. Construction is set to begin in the Q3 of next year.

Once fab construction is completed, ProMOS will be a contender for owning the most 300mm fabs. Currently, it runs two 300mm fabs—one at the Hsinchu Science Park (Fab 2) and another at the Central Taiwan Science Park (Fab 3), where it also began building a third fab in July. That fab will come online next year. It also will shift a 200mm wafer facility (Fab 1) to 300mm wafer production.

ProMOS was the first chip maker to manufacture 300mm wafers in Taiwan in 2001. Within the next few years, its monthly capacity for the bigger wafers will reach 140,000, the company said.

- Cai Yan
EE Times