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Tech bonds different material-based elements without wire bonding

Posted: 12 Sep 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Oki Electric Industry? interconnect technology? interconnect tech? wire bonding? Epi Film Bonding?

Oki Electric Industry Co. Ltd announced a new interconnect technology that allows bonding of different material-based device elements without using conventional wire bonding.

Named Epi Film Bonding (EFB), the intermolecular bonding technology exfoliates a device element grown on a substrate and bonds the thin film on a different device element. Oki claimed that it would open a way to directly combine devices made of different materials.

"The EFB technology enables us to make higher density, multi-layered, faster speed, and lower power consumption semiconductors, which brings possibilities in developing various compound circuit ICs," said Harushige Sugimoto, senior vice president and chief technology officer at Oki Electric, in a statement.

The company has already applied the technology to an LED print head for a commercially available Oki color printer dubbed the C3400n.

For the print head array, Oki engineers exfoliated the light-emitting layer of an LED, based on an AlGaAs compound semiconductor, from a substrate and placed the thin film layer on a driver IC grown on a silicon wafer. The dissimilar semiconductors are physically bonded by the intermolecular bonding force without using any adhesive. The combined devices can be treated as one device and undergo processes such as photolithography and etching. The electrical connection of the LED and the driver IC is done through photolithography.

Compared to conventional print heads that have an LED allay and separate driver ICs connected by wire bonding, the size of the print head with the new LED array is halved, according to Oki.

"Because this technology has so much potential, we will apply this technology beyond semiconductors. We have launched a research unit that includes our R&D team and other affiliated companies to look into adopting this technology to bond dissimilar materials," said Sugimoto.

To demonstrate the technology, Oki developed a prototype LED display, which has 24 x 24 LED elements with driver ICs piled up on a glass substrate using the EFB technology. If the LEDs were laid out in a high density array like the 1,200dpi LED array for a print head, high-definition resolution would be realized in a 2-inch display.

Oki Group will present this technology at the International Conference on Solid State Devices and Materials (SSDM 2006) in Yokohama, Japan this week (Sept. 13-15), and at the 22nd International Conference on Digital Printing Technologies, and Digital Fabrication 2006 in Denver, United States (Sept. 17-22).

- Yoshiko Hara
EE Times

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