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Tessera, Flextronics ink wafer-level assembly deal

Posted: 12 Sep 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Tessera Technologies? miniaturization technology? wafer? Flextronics? Shellcase CF?

Tessera Technologies Inc., a developer of miniaturization technologies for the electronics industry, and Singapore's Flextronics International Ltd, an electronics manufacturing services (EMS) provider, have signed a wafer-level assembly technology licensing agreement.

Under the terms of the agreement, Flextronics has access to Tessera's Shellcase CF technology for use across the company's entire camera module line. Introduced in 2006, Shellcase CF is a wafer-level technology that utilizes the manufacturing infrastructure of conventional chip-on-board assembly processes.

This wafer-level assembly technology is used to assemble optical components integrated into electronic products such as image sensors.

- EE Times

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