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Lattice to debut 90nm FPGA, embedded IP core

Posted: 13 Sep 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Lattice Semiconductor? FPGA? IP core? embedded? LatticeECP2?

Lattice Semiconductor announced it will debut a new FPGA family and an embedded IP core this month. The new 90nm LatticeECP2 FPGAs combine an efficient FPGA fabric with dedicated high-performance DSP blocks on-chip for high-volume, low cost applications.

These new "extreme performance" FPGAs are claimed to provide unsurpassed performance and connectivity for high-speed applications. LatticeXP non-volatile FPGAs combine SRAM and embedded Flash technologies to provide infinite reconfigurability and easy field upgrades. Lattice MachXO non-volatile crossover programmable logic devices support applications traditionally addressed by high density CPLDs or low-capacity FPGAs, but with a more comprehensive and cost-effective architecture and technology.

The new ispPAC Power Manager II devices replace power management functions typically requiring multiple ICs, including reset generators, voltage supervisors, sequencers and trackers. In addition, the ispPAC-POWR1014A device replaces ADC ICs used for power supply voltage measurements, controlled through a standard I?C interface. All Power Manager devices provide a standard, off-the-shelf programmable mixed signal solution for power management that enhances reliability and speeds time-to-market. Analog features such as input comparator thresholds and digital functions such as supply control sequences are programmed into non-volatile E2CMOS elements on the devices using an IEEE1149.1 protocol.

Lattice's ispClock devices substantially reduce clock network design effort. Traditionally, as the performance requirements of the system increased, the effort required to generate and distribute clocks grew exponentially. Programmable ispClock devices provide unprecedented convenience to designers without compromising the system specifications. The devices provide faster time to market, reduced board space and improved manufacturability and reliability.

- Clive Maxfield
EE Times




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