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Ultratech releases new AP lithography tools

Posted: 27 Sep 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Ultratech? advanced-packaging? lithography tools? Unity Gold? Unity Platinum?

Ultratech Inc., a supplier of lithography and laser-processing systems, has introduced two new advanced packaging (AP) lithography tools built on its customizable Unity Platform. According to the company, the new 200mm Unity Gold and 300mm Unity Platinum lithography systems provide cost-effective solutions for foundry customers.

Ultratech said these products represent a tangible solution to address market conditions witnessed by leading wafer foundry customers. Unity Gold provides 150- and 200mm wafer packaging solutions for flat panel display (FPD) applications, while the Unity Platinum lithography system provides 200mm and 300mm wafer processing capabilities for high-volume chip manufacturing.

"As semiconductor chips become more pervasive, there is a greater focus on the economics of global manufacturing. Our newest Unity tools were developed to be key enablers in providing the best cost-effective solutions for our global customers," said Arthur Zafiropoulo, Ultratech chairman and CEO. "We are proud of the strength of our customer relationships as it allows us to gain insight into their challenges and emerging requirements."

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